LED industry is one of the most targeted industries in recent years, with energy saving, power saving, high efficiency and fast response time.The remaining 85% of electrical energy used in a5 is converted to thermal energy.Generally speaking, and does not contain the mercury, has the environmental protection benefit and so on the merit.However, if the thermal energy generated when the LED high-power product input power is about 15%, which can be converted into light _ED luminescence, the LED junction surface temperature will be too high, which will affect the product life cycle, luminous efficiency and stability.Copper has good thermal conductivity and aluminum has good heat dissipation. The copper and aluminum composite heat dissipation base plate is an ideal new material which can not only improve the heat conduction and heat dissipation efficiency of LED chips, but also reduce the production cost. It is the development trend of LED packaging industry. The copper and aluminum composite heat dissipation base plates are increasingly being used in LED aluminium materials.



Product size
Thickness: 0.3-2.0 mm;Width: 600~ 1000mm;Temper: H18
Product features
Flat plate type, high mechanical strength, metallurgical bonding between copper and aluminum, extremely cold and thermal stratification.The LED chip is directly encapsulated on the surface of copper. The heat generated by the chip is transferred from copper to the whole surface directly. Then, the heat conduction performance of copper and the heat dissipation performance of aluminum are given full play.
Technical parameters
Recombination rate: 100%;
Tensile strength: 130~220MPa;
Elongation :5~ 10%;
Copper thickness ratio: 10-20%.