Copper Steel Copper three layer clad plate coil can be used in printed circuit boards, hybrid housings, heat sinks, and other applications requiring CTE matching or thermal expansion constraints. The copper layer provides high thermal conductivity and electrical conductivity while the core layer of Yin Steel reduces the overall expansion during thermal cycling. By adjusting the copper / invar ratio, the coefficient of thermal expansion (CTE) can be adjusted to match the specific electronic devices embedded on the board, and welding fatigue or failure can be reduced.


Signi provides two standard specifications 12.5 / 75 / 12.5 and 20/60/20 copper /Steel / Copper three layer clad plate coil , thickness range 0.006 "-0.062" width up to 24.5 inches. After the standard fully annealed forging process in order to facilitate printed circuit board assembly process required drilling , Shearing and forming process. The material is available in coils or plates.